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| Preliminary Datasheet MICRO POWER STEP-UP DC-DC CONVERTER General Description The AP3015/A are Pulse Frequency Modulation (PFM) DC/DC converters. These two devices are functionally equivalent except the switching current limit. The AP3015 is designed for higher power systems with 350mA current limit, and the AP3015A is for lower power systems with 100mA current limit. The AP3015/A feature a wide input voltage. The operation voltage is ranged from 1.2Vto 12V (1V to 12V for AP3015A). A current limited, fixed off-time control scheme conserves operating current, resulting in high efficiency over a broad range of load current. They also feature low quiescent current, switching current limiting, low temperature coefficient, etc. Fewer tiny external components are required in the applications to save space and lower cost. Furthermore, to ease its use in differnet systems, a disable terminal is designed to turn on or turn off the chip. The AP3015/A are available in SOT-23-5 package. AP3015/A Features * Low Quiescent Current In Active Mode (Not Switching): 17A Typical In Shutdown Mode: <1A Low Operating VIN 1.2V Typical for AP3015 1.0V Typical for AP3015A Low VCESAT Switch 200mV Typical at 300mA for AP3015 70mV Typical at 70mA for AP3015A High Output Voltage: up to 34V Fixed Off-Time Control Switching Current Limiting 350mA Typical for AP3015 100mA Typical for AP3015A Operating Temperature Range: -40oC to 85oC * * * * * * Applications * * * * * MP3, MP4 Battery Power Supply System LCD/OLED Bias Supply Handheld Device Portable Communication Device SOT-23-5 Figure 1. Package Type of AP3015/A Aug. 2006 Rev. 1. 0 1 BCD Semiconductor Manufacturing Limited Preliminary Datasheet MICRO POWER STEP-UP DC-DC CONVERTER Pin Configuration K Package (SOT-23-5) AP3015/A SW GND FB 1 2 3 5 VIN 4 SHDN Figure 2. Pin Configuration of AP3015/A (Top View) Pin Description Pin Number 1 Pin Name SW Function Switch Pin. This is the collector of the internal NPN power switch. Minimize the trace area connected to this Pin to minimize EMI Ground Pin. GND should be tied directly to ground plane for best performance Feedback Pin. Set the output voltage through this pin. The formula is VOUT=1.23V*(1+R1/ R2). Keep the loop between Vout and FB as short as possible to minimize the ripple and noise, which is beneficial to the stability and output ripple Shutdown Control Pin. Tie this pin above 0.9V to enable the device. Tie below 0.25V to turn off the device Supply Input Pin. Bypass this pin with a capacitor as close to the device as possible 2 3 GND FB 4 SHDN 5 VIN Aug. 2006 Rev. 1. 0 2 BCD Semiconductor Manufacturing Limited Preliminary Datasheet MICRO POWER STEP-UP DC-DC CONVERTER Functional Block Diagram AP3015/A 3 FB FEEDBACK COMPARATOR ENABLE 1 SW 5 VIN VREF Bandgap 400nS ONE SHOT DRIVER Q1 RESET 4 SHDN CURRENT-LIMIT COMPARATOR CURRENT-LIMIT REFERENCE 2 GND Figure 3. Functional Block Diagram of AP3015/A Ordering Information AP3015 Circuit Type Blank: AP3015 A: AP3015A E1: Lead Free TR: Tape and Reel Package K: SOT-23-5 Package SOT-23-5 Temperature Range -40 to 85oC Part Number AP3015KTR-E1 AP3015AKTR-E1 Marking ID E6E E6F Packing Type Tape & Reel Tape & Reel BCD Semiconductor's Pb-free products, as designated with "E1" suffix in the part number, are RoHS compliant. Aug. 2006 Rev. 1. 0 3 BCD Semiconductor Manufacturing Limited Preliminary Datasheet MICRO POWER STEP-UP DC-DC CONVERTER Absolute Maximum Ratings (Note 1) Parameter Input Voltage SW Voltage FB Voltage SHDN Pin Voltage Thermal Resistance (Junction to Ambient, no Heat sink) Operating Junction Temperature Storage Temperature Range Lead Temperature (Soldering, 10sec) ESD (Human Body Model) Symbol VIN VSW VFB VSHDN RJA TJ TSTG TLEAD Value 15 36 VIN 15 265 150 -65 to 150 260 3000 Unit V V V V oC/W oC oC oC AP3015/A V Note 1: Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "Recommended Operating Conditions" is not implied. Exposure to "Absolute Maximum Ratings" for extended periods may affect device reliability. Recommended Operating Conditions Parameter Symbol Min Max Unit Input Voltage Operating Temperature VIN TA AP3105 AP3105A 1.2 1.0 -40 12 V 12 85 oC Aug. 2006 Rev. 1. 0 4 BCD Semiconductor Manufacturing Limited Preliminary Datasheet MICRO POWER STEP-UP DC-DC CONVERTER Electrical Characteristics (VIN=VSHDN=1.2V, TA=25oC, unless otherwise specified.) Parameter Input Voltage Symbol VIN Conditions AP3015 AP3015A Quiescent Current Feedback Voltage FB Comparator Hysteresis FB Pin Bias Current Output Voltage Line Regulation Switching Current Limit IQ VFB VFBH IFB LNR IL VFB=1.23V 1.2V AP3015/A Aug. 2006 Rev. 1. 0 5 BCD Semiconductor Manufacturing Limited Preliminary Datasheet MICRO POWER STEP-UP DC-DC CONVERTER Typical Performance Characteristics Unless otherwise noted, VIN=1.2V AP3015/A 20.0 19.5 19.0 1.255 1.250 1.245 Quiescent Current (A) Feedback Voltage (V) Quiescent Current, No Switching VIN=1.2V VIN=12V -25 0 25 50 O 18.5 18.0 17.5 17.0 16.5 16.0 15.5 15.0 14.5 14.0 -50 1.240 1.235 1.230 1.225 1.220 1.215 1.210 1.205 -50 75 100 -25 0 25 50 O 75 100 Junction Temperature ( C) Junction Temperature ( C) Figure 4. Quiescent Current vs. Junction Temperature Figure 5. Feedback Voltage vs. Junction Temperature 450 440 430 40 35 Shutdown Pin Current (A) 30 25 20 15 10 5 0 0.0 O Switch Off Time (ns) 420 410 400 390 380 370 360 350 -50 TJ=-50 C TJ=25 C TJ=100 C O O VFB>1V, VIN=1.2V -25 0 25 50 O 75 100 2.5 5.0 7.5 10.0 12.5 15.0 Junction Temperature ( C) Shutdown Pin Voltage (V) Figure 6. Switch Off Time vs. Junction Temperature Figure 7. Shutdown Pin Current vs. Shutdown Pin Voltage Aug. 2006 Rev. 1. 0 6 BCD Semiconductor Manufacturing Limited Preliminary Datasheet MICRO POWER STEP-UP DC-DC CONVERTER Typical Performance Characteristics (Continued) Unless otherwise noted, VIN=1.2V AP3015/A 500 450 400 350 300 250 AP3015 VIN=1.2V VIN=12V -25 0 25 50 O 200 -50 75 100 120 118 116 114 112 110 108 106 104 102 100 98 96 94 92 90 88 86 84 82 80 -50 Switch Current Limit (mA) Switch Current Limit (mA) AP3015A VIN=1.2V VIN=12V -25 0 25 50 O 75 100 Junction Temperature ( C) Junction Temperature ( C) Figure 8. Switch Current Limit vs. Junction Temperature Figure 9. Switch Current Limit vs. Junction Temperature 250 240 230 80 76 72 Saturation Voltage (mV) 220 210 200 190 180 170 160 150 -50 Saturation Voltage (mV) 68 64 60 56 52 48 44 40 -50 AP3015, ISWITCH=300mA VIN=1.2V VIN=12V -25 0 25 50 O AP3015A, ISWITCH=70mA VIN=1.2V VIN=12V -25 0 25 50 O 75 100 75 100 Junction Temperature ( C) Junction Temperature ( C) Figure 10. Saturation Voltage vs. Junction Temperature Figure 11. Saturation Voltage vs. Junction Temperature Aug. 2006 Rev. 1. 0 7 BCD Semiconductor Manufacturing Limited Preliminary Datasheet MICRO POWER STEP-UP DC-DC CONVERTER Typical Performance Characteristics (Continued) Unless otherwise noted, VIN=1.2V AP3015/A 85 85 80 80 75 75 Efficiency (%) Efficiency (%) 70 70 65 60 55 AP3015 VOUT=20V, L=10H, COUT=1F Refer to Figure 14 VIN=4.2V VIN=3.3V VIN=2.5V 1 10 65 60 55 AP3015A VOUT=3.3V, L=10H, COUT=20F Refer to Figure 15 VIN=2.5V VIN=1.2V 1 10 50 0.1 50 0.1 Load Current (mA) Load Current (mA) Figure 12. Efficiency Figure 13. Efficiency Application Information Operating Principles AP3015/A feature a constant off-time control scheme. Refer to Figure 3 the bandgap voltage VREF (1.23V typical) is used to control the output voltage. When the voltage at the FB pin drops below the lower hysteresis point of Feedback Comparator (typical hysteresis is 8mV), the Feedback Comparator enables the chip and the NPN power switch is turned on, the current in the inductor begins to ramp up and store energy in the coil while the load current is supplied by the output capacitor. Once the current in the inductor reaches the current limit, the Current-Limit Comparator resets the 400ns One-Shot which turns off the NPN switch for 400ns. The SW voltage rises to the output voltage plus a diode drop and the inductor current begins to ramp down. During this time the energy stored in the inductor is transferred to COUT and the load. After the 400ns off-time, the NPN switch is turned on and energy will be stored in the inductor again. This cycle will continue until the voltage at FB pin reaches 1.23V, the Feedback Comparator disables the Aug. 2006 Rev. 1. 0 8 chip and turns off the NPN switch. The load current is then supplied solely by output capacitor and the output voltage will decrease. When the FB pin voltage drops below the lower hysteresis point of Feedback Comparator, the Feedback Comparator enables the device and repeats the cycle described previously. Under not switching condition, the IQ of the device is about 17A. The AP3015/A contain additional circuitry to provide protection during start-up or under short-circuit conditions. When the FB pin voltage is lower than approximately 0.6V, the switch off-time is increased to 1.5s and the current limit is reduced to about 250mA (70mA for AP3015A). This reduces the average inductor current and helps to minimize the power dissipation in the AP3015/A power switch, in the external inductor and in the diode. The SHDN pin can be used to turn off the AP3015/A and reduce the IQ to less than 1A. In shutdown mode the output voltage will be a diode drop below the input voltage. BCD Semiconductor Manufacturing Limited Preliminary Datasheet MICRO POWER STEP-UP DC-DC CONVERTER Typical Application VIN L1 10 D1 SS14 AP3015/A 2.5V to 4.2V VOUT 20V R1 2M C1 4.7F SHDN VIN SW C2 1F FB R2 130K RLOAD AP3015 GND C1, C2: X5R or X7R Ceramic Capacitor L1: SUMIDA CDRH4D16FB/NP-100MC or Equivalent Figure 14. AP3015 Typical Application in LCD/OLED Bias Supply 1.2V to 2.5V VIN L1 10 D1 SS14 VOUT 3.3V R1 1M C1 4.7F SHDN VIN SW C3 10pF C2 20F AP3015A GND FB R2 600K RLOAD C1, C2, C3: X5R or X7R Ceramic Capacitor L1: SUMIDA CDRH4D16FB/NP-100MC or Equivalent Figure 15. AP3015A Typical Application in 1 or 2 Cells to 3.3V Boost Converter Aug. 2006 Rev. 1. 0 9 BCD Semiconductor Manufacturing Limited Preliminary Datasheet MICRO POWER STEP-UP DC-DC CONVERTER Mechanical Dimensions SOT-23-5 Unit: mm(inch) AP3015/A 2.820(0.111) 3.020(0.119) 0.100(0.004) 0.200(0.008) 2.650(0.104) 2.950(0.116) 1.500(0.059) 1.700(0.067) 0.200(0.008) 0.700(0.028) REF 0.950(0.037) TYP 0.300(0.012) 0.400(0.016) 1.800(0.071) 2.000(0.079) 0.300(0.012) 0.600(0.024) 0 8 1.050(0.041) 1.250(0.049) 0.000(0.000) 0.100(0.004) 1.050(0.041) 1.150(0.045) Aug. 2006 Rev. 1. 0 10 BCD Semiconductor Manufacturing Limited http://www.bcdsemi.com IMPORTANT NOTICE BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifications herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or other rights nor the rights of others. MAIN SITE BCD Semiconductor Manufacturing Limited - Wafer Fab Shanghai SIM-BCD Semiconductor Manufacturing Limited 800, Yi Shan Road, Shanghai 200233, China Tel: +86-21-6485 1491, Fax: +86-21-5450 0008 BCD Semiconductor Manufacturing Limited - IC Design Group Advanced Analog Circuits (Shanghai) Corporation 8F, Zone B, 900, Yi Shan Road, Shanghai 200233, China Tel: +86-21-6495 9539, Fax: +86-21-6485 9673 REGIONAL SALES OFFICE Shenzhen Office Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd. Shenzhen Office Advanced Analog Circuits (Shanghai) Corporation Shenzhen Office Room E, 5F, Noble Center, No.1006, 3rd Fuzhong Road, Futian District, Shenzhen 518026, China Tel: +86-755-8826 7951, Fax: +86-755-8826 7865 Taiwan Office BCD Semiconductor (Taiwan) Company Limited 4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, Taiwan Tel: +886-2-2656 2808, Fax: +886-2-2656 2806 USA Office BCD Semiconductor Corporation 3170 De La Cruz Blvd., Suite 105, Santa Clara, CA 95054-2411, U.S.A |
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